Features & Benefits
- Offers four pitch options (0.3mm, 0.35mm, 0.4mm, 0.5mm) for various BGA chip sizes.
- Designed for accurate solder ball placement with stable high-temperature performance.
- Compact and portable design ideal for easy storage and on-the-go use.
- Versatile compatibility with common ICs in modern mobile phones and electronics.
- Durable stainless steel construction ensures long-lasting use in repair environments.